In a first, PKU team wins sole outstanding paper award at 2024 ISSCC
Feb 27, 2024
The award ceremony
Peking University, February 26, 2024: In a significant breakthrough, a team from Peking University's School of Integrated Circuits has been announced as the sole recipient of the 2023 Anantha P. Chandrakasan Award for Outstanding Distinguished Technical Paper at the International Solid-State Circuits Conference (ISSCC), held from Feb. 18 to 22, 2024, in San Francisco.
Led by Academician Huang Ru and Prof. Ye Le, along with researcher Shen Linxiao, the team has attained the highest academic honor in integrated circuit design, marking the first instance of a Chinese Mainland institution winning this award since the inception of ISSCC 70 years ago. This historic achievement underscores the international recognition of the Peking University team's innovation in the field of integrated circuit design.
The citation
Gao Jihang, a second-year Ph.D. student at the School of Integrated Circuits, Peking University, is the first author of the paper titled "A 7.9fJ/Conversion-Step and 37.12aFrms Pipelined-SAR Capacitance-to-Digital Converter with kT/C Noise Cancellation and Incomplete-Settling-Based Correlated Level Shifting," with Shen Linxiao and Prof. Ye Le as corresponding authors. The paper also received technical support from Li Heyi, Ye Siyuan, Li Jie, Xu Xinhang, Cui Jiajia, Gao Runxiong, and other students at Peking University.
Graphic/School of Integrated Circuits, PKU
The ISSCC stands as the world's premier global forum for presenting advances in solid-state circuits and systems-on-a-chip and is regarded as the highest academic conference in the field of integrated circuit design, often dubbed the "International Olympiad in Chip Design." Each year, ISSCC selects over 200 chip measurement results, representing the foremost level of advancement in chip technology and industry trends.
The Anantha P. Chandrakasan Award for Outstanding Distinguished-Technical Paper, awarded annually, is the most prestigious honor presented by the ISSCC, under the sponsorship of the Institute of Electrical and Electronics Engineers (IEEE).
Written by: Wang Yu-Hsuan
Edited by: Dennis Meng
Source: School of Integrated Circuits